【資料成文時(shí)間】：2006
【語(yǔ)言】：en
【頁(yè)數(shù)】：57
【何人（公司）所著】：siemens
【文件格式】：doc
【文件原名】：Description for MGW Mobile
【摘要或目錄】：
0 GENERAL INFORMATION5
0.1 Issue Control5
0.2 History5
0.3 References5
0.3.1 LM Numbers5
0.4 Glossary and Abbreviations6
0.5 Keyword/Descriptor10
0.6 List of Figures and Tables11
1 INTRODUCTION12
1.1 Scope13
1.2 Assumptions and Dependencies13
1.3 Affected Systems and Platform Description14
1.4 Outstanding Issues15
2 Technical Data16
2.1 Mechanical Design16
2.2 Rack18
2.3 Module Power Consumption18
3 HW Components and Functionality19
3.1 Shelf/Chassis and Backplane19
3.2 Shelf Manager20
3.3 Zone 3 Midplane21
3.4 MGW Boards22
3.4.1 CPU daughter card (SM:CPU)22
3.4.2 Hub Card (M:HUGE)23
3.4.3 Rear Transition Module for the Hub Card (M:RTMETH)24
3.4.4 SPE/CPE Card (M:GPP970D)25
3.4.5 Media Stream Board26
3.4.5.1 Wire line MSB (M:MSB-F)27
3.4.5.2 Wireless MSB (M:MSB-M)27
3.4.5.3 Submodule for wireless MSB (SM:MSB-M)29
3.4.6 Line Interface Cards30
3.4.6.1 TDM Card (MICTDM)30
3.4.6.2 Submodule for the TDM Card (SM:TDMEC)31
3.4.6.3 MICAIP4 as ATM Card32
3.4.6.4 MICAIP4 as IP Card36
3.4.6.5 Optical Rear Transition Module (M:RTMEO)37
3.5 Interconnect Infrastructure39
3.6 Redundancy Considerations40
3.6.1 Fabric Redundancy of Hub Card41
3.6.2 SPE/CPE Server Blade Redundancy42
3.6.3 MSB Redundancy42
3.6.4 TDM Card Redundancy44
3.6.5 ATM Card Redundancy45
3.6.6 IP Card Redundancy46
3.7 List of Functional Units49
3.7.1 List of HW Functional Units49
3.7.2 List of OEM Hardware49
3.8 MGW Configuration Variants50
3.8.1 Minimum and maximum number of boards51
3.8.2 Minimum Wireless MGW Configuration51
3.8.3 Number of ATM LICs52
3.8.4 CS/PSTN MGW52
3.8.5 IMS MGW54
3.8.6 Wireless AAL2 Switch Configuration55
4 TEST STRATEGY57
4.1 Strategy57
4.2 Test Scope57