【資料名稱】：ZXCBTS CDMA微基站（DO） 技術手冊

【資料作者】：ZTE

【資料日期】：xxx

【資料語言】：中文

【資料格式】：PDF

【資料目錄和簡介】：

第1章 基礎知識.......................................................................................................................................1-1
1.1 移動通信系統(tǒng)................................................................................................................................1-1
1.2 CDMA2000 1x標準演進.................................................................................................................1-2
1.3 1x EV-DO網(wǎng)絡參考模型.................................................................................................................1-3
1.4 1x EV-DO關鍵技術.........................................................................................................................1-4
1.4.1 功率控制...............................................................................................................................1-4
1.4.2 速率控制...............................................................................................................................1-4
1.4.3 時分復用...............................................................................................................................1-5
1.4.4 多用戶調(diào)度...........................................................................................................................1-5
1.4.5 HARQ....................................................................................................................................1-6
1.4.6 虛擬軟切換...........................................................................................................................1-6
1.4.7 自適應調(diào)制編碼技術...........................................................................................................1-7
1.5 1x EV-DO信道................................................................................................................................1-7
1.5.1 Rev.0信道..............................................................................................................................1-8
1.5.2 Rev.A信道............................................................................................................................1-12
1.6 Rev.A對QoS的增強.......................................................................................................................1-14
第2章 系統(tǒng)概述.......................................................................................................................................2-1
2.1 產(chǎn)品簡介........................................................................................................................................2-1
2.2 DO微基站在系統(tǒng)中的位置.............................................................................................................2-2
2.3 主要功能........................................................................................................................................2-2
2.4 系統(tǒng)特征........................................................................................................................................2-3
第3章 系統(tǒng)結構.......................................................................................................................................3-1
3.1 概述................................................................................................................................................3-1
3.2 基帶數(shù)字子系統(tǒng).............................................................................................................................3-2
3.3 射頻子系統(tǒng)....................................................................................................................................3-3
3.3.1 MTRX....................................................................................................................................3-6
3.3.2 MPA.......................................................................................................................................3-7
3.3.3 MLNA...................................................................................................................................3-8
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3.3.4 MDUP...................................................................................................................................3-8
3.3.5 MDIV....................................................................................................................................3-8
3.4 時鐘頻率子系統(tǒng).............................................................................................................................3-9
3.5 傳輸子系統(tǒng)..................................................................................................................................3-10
3.6 電源子系統(tǒng)..................................................................................................................................3-11
第4章 操作與維護..................................................................................................................................4-1
4.1 性能管理模塊................................................................................................................................4-1
4.2 故障管理模塊................................................................................................................................4-1
4.3 系統(tǒng)工具模塊................................................................................................................................4-2
4.4 版本管理模塊................................................................................................................................4-2
4.5 狀態(tài)控制模塊................................................................................................................................4-2
4.6 實時監(jiān)控模塊................................................................................................................................4-2
第5章 組網(wǎng)和配置..................................................................................................................................5-1
5.1 Abis接口組網(wǎng).................................................................................................................................5-1
5.2 DO微基站和射頻遠端站組網(wǎng)........................................................................................................5-3
5.3 小區(qū)分裂方案................................................................................................................................5-4
5.4 系統(tǒng)配置........................................................................................................................................5-4
5.4.1 單載單扇...............................................................................................................................5-5
5.4.2 單載兩扇...............................................................................................................................5-6
5.4.3 單載三扇...............................................................................................................................5-7
5.4.4 兩載單扇...............................................................................................................................5-8
5.4.5 三載單扇...............................................................................................................................5-9
第6章 技術指標......................................................................................................................................6-1
6.1 環(huán)境指標........................................................................................................................................6-1
6.1.1 非電氣指標...........................................................................................................................6-1
6.1.2 電源指標...............................................................................................................................6-1
6.1.3 功耗......................................................................................................................................6-2
6.2 性能指標........................................................................................................................................6-2
6.2.1 可靠性指標...........................................................................................................................6-2
6.2.2 接口指標...............................................................................................................................6-2
6.2.3 容量指標...............................................................................................................................6-3
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6.2.4 射頻指標...............................................................................................................................6-3
6.2.5 時鐘指標...............................................................................................................................6-6
6.2.6 安全指標...............................................................................................................................6-6
6.2.7 EMC指標...............................................................................................................................6-6
第7章 可靠性設計...................................................................................................................................7-1
7.1 硬件可靠性....................................................................................................................................7-1
7.1.1 簡化設計...............................................................................................................................7-1
7.1.2 元器件設計...........................................................................................................................7-1
7.1.3 熱設計..................................................................................................................................7-1
7.1.4 防護設計...............................................................................................................................7-2
7.1.5 防傳導干擾設計...................................................................................................................7-2
7.1.6 安全性設計...........................................................................................................................7-2
7.1.7 可測試性設計.......................................................................................................................7-2
7.1.8 防錯設計...............................................................................................................................7-2
7.2 軟件可靠性....................................................................................................................................7-2
7.2.1 需求分析階段.......................................................................................................................7-2
7.2.2 設計階段...............................................................................................................................7-3
7.2.3 測試階段...............................................................................................................................7-3
7.2.4 維護階段...............................................................................................................................7-4
附錄A 遵循標準.......................................................................................................................................A-1
附錄B 縮略語...........................................................................................................................................B-1