【資料名稱】：TDM E1T1業(yè)務(wù)透傳白皮書

【資料作者】：華為

【資料日期】：2007

【資料語言】：中文

【資料格式】：PDF

【資料目錄和簡介】：

1 前言............................................................................................................................1
1.1 TDM電路仿真技術(shù)背景......................................................................................1
1.2 相關(guān)技術(shù)標(biāo)準(zhǔn)......................................................................................................2
2 技術(shù)簡介....................................................................................................................2
2.1 TDM PWE3技術(shù)方案..........................................................................................2
2.2 其他技術(shù)方案......................................................................................................6
3 關(guān)鍵技術(shù)....................................................................................................................8
3.1 數(shù)據(jù)抖動緩存......................................................................................................8
3.2 同步定時信息恢復(fù)...............................................................................................8
3.3 鏈路故障檢測......................................................................................................8
3.4 數(shù)據(jù)包延時分析...................................................................................................9
3.5 通道化和非通道技術(shù)...........................................................................................9
4 典型應(yīng)用..................................................................................................................11
4.1 城域網(wǎng)專線接入和匯聚......................................................................................11
4.2 以太承載的基站Backhaul.................................................................................12
5 結(jié)束語......................................................................................................................13
附錄A 參考資料.............................................................................................................14
附錄B 縮略語.................................................................................................................14