【資料成文時間】：2008-01-11
【語言】：Chinese
【頁數(shù)】：63
【何人（公司）所著】：華為
【文件格式】：pdf
【文件原名】：華為RNC設(shè)計文檔.pdf
【摘要或目錄】：
1 前言 ............................................................................................................................... 3
2 總體結(jié)構(gòu) ................................ ................................ ................................ ........................ 3
2.1 網(wǎng)絡(luò)結(jié)構(gòu) .......................................................................................................... 3
1.1 RNC 總體結(jié)構(gòu)..................................................................................................5
1.1 RNC 對外接口..................................................................................................6
1.1. RNC 組網(wǎng)圖...................................................................................................... 7
1.1 RNC 設(shè)計指標(biāo)[2] ............................................................................................. 8
1.1 產(chǎn)品數(shù)據(jù)結(jié)構(gòu)描述 ............................................................................................ 9
1 硬件實現(xiàn)方案 ...............................................................................................................10
1.1 硬件總體結(jié)構(gòu).................................................................................................10
1.1 物理單板結(jié)構(gòu) ................................................................................................. 11
1.1.1 MCP750 板................................ ................................ .............................. 11
1.1.1 HSC 板....................................................................................................12
1.1.2 MCPN750 板............................................................................................12
1.1.1 ETPA 板...................................................................................................13
1.1.2 ETKA板..................................................................................................13
1.1.1 BAK 板....................................................................................................14
1.1.1 RSK 板....................................................................................................14
1 軟件實現(xiàn)方案 ...............................................................................................................18
1.1 總體結(jié)構(gòu) ........................................................................................................18
1.1 網(wǎng)絡(luò)平臺子系統(tǒng)（NPS） ................................................................................19
1.1 業(yè)務(wù)處理子系統(tǒng)（SPS）.................................................................................20
1.1 計費子系統(tǒng)（RRM） ................................ ................................ ......................22
1.1 資源控制子系統(tǒng)（RCS） ................................................................................23
1.1 操作維護（OM）............................................................................................25
1.1 單板軟件結(jié)構(gòu) .................................................................................................26
1.1 功能流程........................................................................................................30
1.1.1 信令處理流程 ..........................................................................................32
1.1.2 數(shù)據(jù)轉(zhuǎn)發(fā)流程..........................................................................................35
1.2 軟件開發(fā)平臺 .................................................................................................36
2 信號完整性工程設(shè)計.....................................................................................................36
2.1 關(guān)鍵總線分析.................................................................................................36
2.1.1 PCI 總線簡介...........................................................................................36
2.1.2 CompactPCI 簡介.....................................................................................36
2.2 物理實現(xiàn)關(guān)鍵技術(shù)分析 ...................................................................................38
3 可靠性設(shè)計 ...................................................................................................................38
3.1 MPU板倒換備份............................................................................................38
3.2 計費高可靠性.................................................................................................40
4 器件選型 ................................ ................................ ................................ ......................41
4.1 電源選型方案 .................................................................................................41
1.1 計算機\網(wǎng)絡(luò)配套設(shè)備選型方案........................................................................41
1.1.1 LAN Switch 認(rèn)證方案................................ ................................ ..............41
1.1.2 對 Router 的需求................................ ................................ ......................42
2 可維護性設(shè)計 ...............................................................................................................42
2.1 狀態(tài)指示 ........................................................................................................42
2.2 測試 ...............................................................................................................42
2.3 軟硬件版本信息在線上報和軟件加載................................ ..............................43
2.4 網(wǎng)管及遠(yuǎn)程維護................................ ................................ ..............................43
2.5 故障定位及處理................................ ................................ ..............................43
2.6 人機界面設(shè)計 .................................................................................................44
2.7 數(shù)據(jù)設(shè)定與操作................................ ................................ ..............................44
2.8 可擴容性 ........................................................................................................44
3 可測性設(shè)計...................................................................................................................45
3.1 測試項目設(shè)計.................................................................................................45
3.2 可測性需求設(shè)計................................ ................................ ..............................45
3.3 裝備可測性設(shè)計方案.......................................................................................45
4 結(jié)構(gòu)、外觀設(shè)計方案.....................................................................................................46
4.1 造型設(shè)計方案 .................................................................................................46
4.2 結(jié)構(gòu)設(shè)計方案及系統(tǒng)配置................................................................................46
4.3 安裝設(shè)計方案 .................................................................................................47
4.4 結(jié)構(gòu)熱設(shè)計方案................................ ................................ ..............................47
4.5 結(jié)構(gòu) EMC 設(shè)計方案........................................................................................47
5 工藝設(shè)計方案 ...............................................................................................................47
5.1 配線方案 ........................................................................................................47
5.2 關(guān)鍵工藝的解決方案.......................................................................................49
5.3 產(chǎn)品測試路線 .................................................................................................52
5.4 產(chǎn)品制造方案 .................................................................................................52
5.4.1 機柜/插框/部件總體方案..........................................................................52
5.4.2 防護性.....................................................................................................53
5.4.3 可運輸性 .................................................................................................53
5.4.4 特殊工藝流程 ..........................................................................................54
5.4.5 制造瓶頸分析及解決................................................................................54
6 環(huán)境適應(yīng)性設(shè)計的實現(xiàn)方案..........................................................................................54
6.1 潔凈度要求.....................................................................................................54
1.1 抗干擾要求.....................................................................................................55
1.2 空間要求 ........................................................................................................55
1.3 接地要求 ........................................................................................................55
1.4 溫度濕度要求 .................................................................................................55
1 電源及外購?fù)獍�件需求定義..........................................................................................56
1 安全性 ..........................................................................................................................60
2 電磁兼容設(shè)計方案 ........................................................................................................60
3 產(chǎn)品規(guī)格其他內(nèi)容的實現(xiàn)途徑.......................................................................................61
4 候選方案 ................................ ................................ ................................ ......................61

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