【資料成文時間】：2007-5-24
【語言】：中文
【頁數(shù)】：68
【何人（公司）所著】：鼎橋
【文件格式】：PDF
【文件原名】：TNB610技術描述手冊.
【摘要或目錄】：
目 錄
第1章 特性和技術參數(shù)................................................................................................................ 1
1.1 主要特性...........................................................................................................................1
1.2 主要業(yè)務和功能.................................................................................................................1
1.2.1 業(yè)務........................................................................................................................1
1.2.2 位置定位業(yè)務..........................................................................................................2
1.2.3 切換........................................................................................................................2
1.2.4 非對稱轉換..............................................................................................................3
1.2.5 N頻點.....................................................................................................................3
1.2.6 HSDPA技術...........................................................................................................4
1.3 技術數(shù)據...........................................................................................................................4
1.3.1 電氣和機械規(guī)格.......................................................................................................4
1.3.2 性能........................................................................................................................5
1.3.3 可靠性.....................................................................................................................6
第2章 硬件結構........................................................................................................................... 7
2.1 整體硬件架構....................................................................................................................9
2.2 天線子系統(tǒng)結構...............................................................................................................11
2.3 機架和子框配置...............................................................................................................12
2.3.1 機架配置...............................................................................................................12
2.3.2 子框配置...............................................................................................................13
第3章 模塊描述......................................................................................................................... 15
3.1 CCB...............................................................................................................................15
3.1.1 功能部件描述........................................................................................................16
3.1.2 CCB外部接口.......................................................................................................18
3.1.3 測試和維護接口.....................................................................................................18
3.2 SIPROC.........................................................................................................................19
3.2.1 功能描述...............................................................................................................19
3.2.2 功能結構...............................................................................................................19
3.2.3 SIPROC框圖........................................................................................................20
3.2.4 功能模塊描述........................................................................................................20
3.2.5 外部接口...............................................................................................................20
3.3 RFTRXU.........................................................................................................................21
3.3.1 功能描述...............................................................................................................21
3.3.2 接口描述...............................................................................................................23
3.3.3 性能......................................................................................................................24
3.3.4 機械構造...............................................................................................................24
3.4 ACT...............................................................................................................................25
3.4.1 功能描述...............................................................................................................26
3.4.2 接口......................................................................................................................27
3.5 FAN...............................................................................................................................27
3.6 PROMO..........................................................................................................................27
3.6.1 功能描述...............................................................................................................27
3.6.2 接口描述...............................................................................................................28
3.6.3 機械尺寸...............................................................................................................28
3.7 Iub連接器.......................................................................................................................29
3.7.1 IUBCON...............................................................................................................29
3.7.2 OVPT ...................................................................................................................29
3.8 LIPO..............................................................................................................................30
3.8.1 接口......................................................................................................................30
3.8.2 LIPO 接頭.............................................................................................................31
3.9 PRTD.............................................................................................................................31
3.10 GPS子系統(tǒng)...................................................................................................................31
3.10.1 GPS接收模塊.....................................................................................................32
3.10.2 GPS天線............................................................................................................33
3.11 SWIPA..........................................................................................................................33
3.11.1 結構描述.............................................................................................................34
3.11.2 功能描述.............................................................................................................36
3.11.3 接口....................................................................................................................37
3.11.4 SWIPA性能........................................................................................................37
3.12 Y-BOX..........................................................................................................................39
3.13 天線濾波器....................................................................................................................40
3.13.1 功能描述.............................................................................................................40
3.13.2 接口描述.............................................................................................................40
3.13.3 性能....................................................................................................................40
3.14 智能天線.......................................................................................................................41
3.14.1 圓形天線陣..........................................................................................................41
3.14.2 平板天線陣..........................................................................................................43
第4章 供電............................................................................................................................... 47
4.1 直流供電.........................................................................................................................47
4.2 功率消耗.........................................................................................................................47
第5章 系統(tǒng)擴容......................................................................................................................... 48
5.1 硬件擴容.........................................................................................................................49
5.2 軟件升級.........................................................................................................................50
第6章 Iub接口和鏈路配置類型................................................................................................ 53
6.1 Iub物理接口類型.............................................................................................................53
6.2 NodeB的拓撲結構（TNB610到RNC）..........................................................................53
6.2.1 星型連接...............................................................................................................53
6.2.2 鏈型連接...............................................................................................................53
6.3 IMA................................................................................................................................54
6.4 STM-1.............................................................................................................................54
6.4.1 STM-1 VC-4、NodeB和RNC側...........................................................................55
6.4.2 STM-1 VC-12、NodeB和RNC側.........................................................................55
第7章 NodeB本地維護終端（LMT-B）................................................................................... 56
7.1 配置要求.........................................................................................................................56
7.2 LMT-B和NodeB之間的T接口.......................................................................................56
第8章 環(huán)境要求......................................................................................................................... 57
8.1 保存和運輸......................................................................................................................57
8.2 室內長期使用要求...........................................................................................................57
8.3 電磁兼容（EMC）...........................................................................................................58
8.3.1 歐洲/世界（不包括北美）的輻射需求....................................................................58
8.3.2 抗干擾要求............................................................................................................59
第9章 產品安全和EMF保護.................................................................................................... 61
9.1 產品安全.........................................................................................................................61
9.2 供電接口.........................................................................................................................61
9.3 EMF（電磁場）保護.......................................................................................................62
第10章 有毒有害物質含量聲明................................................................................................. 63
第11章 縮略語.......................................................................................................................... 65